CNC Drilling & Milling
MPC2000 MC
Versatile multi-process with milling, up to 5 processes
Up to 5: precision plasma, plasma beveling, oxyfuel, drilling, tapping, milling, markers
Processes
4
Process heads
Up to 2.5" (63.5mm) with chip breaking cycles
Drilling capacity
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Ideal For
- Facilities needing drilling, tapping, milling, plasma, and oxyfuel in one machine
- Operations processing plate up to 28' wide and 200' long
- Shops requiring machining-centre accuracy (0.003" repeatability) on plate
- High-volume structural fabricators seeking multi-process efficiency
Processes
Up to 5: precision plasma, plasma beveling, oxyfuel, drilling, tapping, milling, markers
Process heads
4
Drilling capacity
Up to 2.5" (63.5mm) with chip breaking cycles
Motion accuracy
+/- 0.010" in 72" travel
Key Features
MPC2000 MC Features
Standard features that set this machine apart in demanding manufacturing environments.
Precision & Performance
- Precision plasma cutting and beveling
- +/- 0.010" motion accuracy in 72" travel
- 0.003" repeatability (ISO 230-2)
- Linear motion ways
- AC servo drives
- PL-1 plasma torch lifter with 880 IPM traverse speed
- Enhanced linear motion ways for smooth, stable travel
Ease of Operation
- SureStop collision sensor with automatic recovery
- Virtual Service remote diagnostics and consultation
Safety & Reliability
- Drilling up to 2.5" with chip breaking cycles
- High-suction chip vacuum system
- Collection hopper for steel chip recycling
- UL/cUL certified for Canadian and U.S. operation
Cutting Capability
- Milling capability (key difference from MPC2000)
- Tapping capability
- Long-life band drives with larger end trucks
Built-In Extras
- Up to 5 simultaneous processes
- Multiple reference point positions for flexible setup
Gallery
MPC2000 MC in Detail
Video
See the MPC2000 MC in Action
Full Specifications
MPC2000 MC Technical Details
Complete specifications, standard features, and optional upgrades.
- Processes
- Up to 5: precision plasma, plasma beveling, oxyfuel, drilling, tapping, milling, markers
- Process heads
- 4
- Drilling capacity
- Up to 2.5" (63.5mm) with chip breaking cycles
- Motion accuracy
- +/- 0.010" in 72" travel
- Repeatability
- 0.003" (laser interferometer per ISO 230-2)
- Motion
- Linear motion ways
- Drives
- AC servo
- Chip management
- High-suction chip vacuum system + collection hopper for recycling
- Cutting widths
- 12' to 28'
- Cutting lengths
- Up to 200'
- Maximum material thickness
- 8" (203.2 mm)
- Contouring speed
- 400 IPM
- Positioning speed
- 1,400 IPM
- Spindle
- CAT 50 taper with mist coolant
- Plasma capacity
- Up to 800 amps
- CNC control
- Messer Global ControlPlus with Windows-based interface
| Processes | Up to 5: precision plasma, plasma beveling, oxyfuel, drilling, tapping, milling, markers |
| Process heads | 4 |
| Drilling capacity | Up to 2.5" (63.5mm) with chip breaking cycles |
| Motion accuracy | +/- 0.010" in 72" travel |
| Repeatability | 0.003" (laser interferometer per ISO 230-2) |
| Motion | Linear motion ways |
| Drives | AC servo |
| Chip management | High-suction chip vacuum system + collection hopper for recycling |
| Cutting widths | 12' to 28' |
| Cutting lengths | Up to 200' |
| Maximum material thickness | 8" (203.2 mm) |
| Contouring speed | 400 IPM |
| Positioning speed | 1,400 IPM |
| Spindle | CAT 50 taper with mist coolant |
| Plasma capacity | Up to 800 amps |
| CNC control | Messer Global ControlPlus with Windows-based interface |
- Up to 5 simultaneous processes
- Milling capability (key difference from MPC2000)
- Precision plasma cutting and beveling
- Drilling up to 2.5" with chip breaking cycles
- Tapping capability
- +/- 0.010" motion accuracy in 72" travel
- 0.003" repeatability (ISO 230-2)
- Linear motion ways
- AC servo drives
- High-suction chip vacuum system
- Collection hopper for steel chip recycling
- SureStop collision sensor with automatic recovery
- PL-1 plasma torch lifter with 880 IPM traverse speed
- Virtual Service remote diagnostics and consultation
- Multiple reference point positions for flexible setup
- Enhanced linear motion ways for smooth, stable travel
- Long-life band drives with larger end trucks
- UL/cUL certified for Canadian and U.S. operation
- Plasma cutting up to 800 amps
- Global Rotator Infinity heavy-duty compound skew bevel
- Global Rotator Delta e compound skew plasma bevel
- Oxyfuel bevel units (single-position, three-position, contour)
- Omniflow automated gas regulation system
- 24-tool rotary automatic tool changer
- Video alignment system for precise part positioning
- Laser pointer for visual torch reference
- Rotary rail cleaners for maintenance-free track operation
- Operator riding platform with glare curtains
- Zoned exhaust tables (Slagger self-cleaning)
- Dust collection and exhaust systems
- Messer OMNIWIN nesting software
- Machine Insight production monitoring software
- OmniFab Industry 4.0 suite
- Heavy structural steel fabrication with integrated drilling and milling
- Steel service centres processing large-format plate up to 8" thick
- Shipbuilding and offshore fabrication
- Bridge and infrastructure plate processing
- OEM manufacturers requiring multi-process capability on a single machine
FAQ
MPC2000 MC Questions
Answers to common questions about the MPC2000 MC.
The MPC2000 MC is built around mechanical drilling and milling, not just thermal cutting. This delivers higher hole accuracy and tighter tolerances than plasma-drilled holes, reducing or eliminating secondary machining operations.
Yes. Plasma cutting up to 800 amps can be integrated as a secondary process, giving you profiling, bevelling, and drilling/milling on a single machine.
Yes. It is commonly used for applications requiring drilled and machined holes in plate and structural components, with accuracy of +/-0.010" and repeatability of 0.003" per ISO 230-2.
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