MESSER MPC2000 MC

MPC2000 MC

The MPC2000 MC is a versatile plate processing system offering up to five processes, including precision plasma, plasma beveling, oxyfuel, drilling (up to 2.5”), tapping, milling, and markers, supported by four tool stations. The MPC2000 MC ensures clean, precise cuts and holes with high accuracy. Featuring linear motion ways and reliable AC servo drives, the MPC2000 MC delivers optimal machine performance. Its drilling and milling high-suction chip vacuum system enhances operator safety and accuracy, along with a collection hopper for steel chip recycling.

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